Reaction Bonded Ceramics

Metal Matrix Composites

Ceramics and Metal Matrix Composites

?II-VI provides customers with material solutions using our advanced composite materials, manufacturing expertise, and application skills. Our core material engineering group continues to formulate solutions for products in the industrial wear, nuclear, armor, LCD glass, semiconductor capital equipment, chip manufacturing, solar, oil and gas and refractory industries.

II-VI’s materials can be tailored to match critical system performance needs including CTE, thermal conductivity, modulus, etc. II-VI’s materials technology is scalable both in terms of high volume production and in the size and complexity of product shapes.

II-VI provides the marketplace with products that improve performance and improve the return on investment for our customers.

Materials

Metal Matrix Composites

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Full Materials Table

?PropertyAluminum?Metal?Matrix?Composites Reaction?Bonded?SiC Specialty?Reaction?Bonded?Ceramics
GREENBLUEGOLDSSC-702SSC-802SSC-902SSC-FGHSC-702TSC-15RBBC-751
(Al/SiC)(Al/SiC)(Al/SiC)(Si/SiC)(Si/SiC)(Si/SiC)(Si/SiC)(Si/SiC+Al)(Si/SiC+Ti)(B4C/SiC/Si)
Density (g/cc) [ρ]2.782.872.962.9533.122.943.013.132.56
Poisson’s Ratio0.290.280.250.180.180.180.180.190.190.18
Young’s Modulus (GPa) [E]125150200350380410330330390400
CTE avg 20-100?C (ppm/K) [α]1512112.92.92.73.04.43.04.8
Thermal Conductivity (W/m-K) [k]16016016017018019015020021052
Specific Heat (J/kg-K)820750730680670660680700670890
Ultimate Tensile Strength (MPa)370370340NANANANANANANA
Flexural Strength (MPa)NANANA270280280350275225280
Fracture Toughness (MPa-m1/2)151413444.04.05.05.05.0
Damping Factor (% Zeta)0.240.260.580.12---------------
Specific Stiffness (E/ρ)455268119127131112109125156
Thermal Stability (k/α)11131459627050457011

II-VI Incorporated Introduces Silicon Carbide Ceramic Materials with Record Thermal Conductivity of 255 W/(m-K) for Power Electronics Modules

February 11, 2021
II‐VI Incorporated (Nasdaq: IIVI), a leading provider of components based on reaction-bonded ceramics and metal-matrix composites, today announced that it introduced a new grade of its proprietary reaction-bonded silicon carbide ceramic material, with a record thermal conductivity of 255 W/(m-K), for power electronics applications, including IGBT baseplates. The growing interest in clean energy is accelerating the electrification of the global...
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